Simyog Webinar on Multiscale Modeling and Simulation for Automotive EMC Compliance

Overview

Automotive electronics is growing rapidly in complexity and density, and with it, the challenge of achieving EMC compliance before products reach the lab. Industry data shows that 50 to 90% of products fail their first EMC submission — not because engineers lack skill, but because EMC is routinely treated as an afterthought rather than a design input. The cost shows up as repeated lab visits, multiple board respins, and months of delayed time to market.

This webinar makes the case for predictive, multiscale EMC modeling integrated directly into the design cycle. Presented by Nikita Ambassana, the session explains why automotive EMC is inherently a multiscale problem — spanning spatial scales from the nanometer-level MOSFET all the way to meter-long vehicle harnesses — and demonstrates how Compliance-Scope® brings all of these scales together in a single unified simulation environment. The session covers conducted emissions, radiated emissions, bulk current injection, and radiated immunity, with real customer validation data and diagnosis case studies showing how simulation can both predict failures and guide engineers to the right fix.

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Key Topics Covered

• Why automotive EMC compliance failures are so prevalent and what the design cycle cost looks like
• The multiscale nature of automotive EMC: die, package, PCB, cable, table, chamber, and antenna all interact
• Breaking the problem into source and transfer function: what X(f), H(f), and Y(f) reveal about emission failures
• Modeling the full CISPR 25 CE and RE environments: LISN, harness, table, antenna, and DUT in one system
• How 3D full-wave EM solver, 2D solver, and RF circuit solver work together within Compliance-Scope®
• IC source modeling: measured waveforms, SPICE-based waveforms, and datasheet-based IC models
• Simulation-to-measurement correlation for conducted and radiated emissions across multiple customer devices
• Modeling immunity tests: bulk current injection (ISO 11452-4) and radiated immunity (ISO 11452-2)
• Predicting IC pin voltage failures and failure regions under immunity testing
• Customer diagnosis case studies: CE failure from secondary ground loop noise, LIN bus failure from capacitor placement, and radiated immunity failure for a high-side gate driver
• Using current density plots and E-field diagnostics to identify failure mechanisms and guide layout fixes
• Sensitivity and what-if analysis for fast component-level optimization without full re-simulation
• Live demonstration of the Compliance-Scope® CE simulation workflow

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Who Should Watch

• EMC/EMI Engineers at IC suppliers, Tier-1 suppliers, and OEMs
• Hardware and PCB Designers working on automotive electronics
• Power Electronics Engineers designing DC-DC converters and gate drivers
• Validation and Compliance Teams across automotive and semiconductor organizations
• Engineers new to multiscale EMC modeling looking for a practical starting point

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What You'll Learn

• Why treating EMC as an afterthought consistently leads to lab failures and how front-loading simulation changes that outcome
• How to think about the source and transfer function separately to identify whether an emission problem lives in the IC or in the rest of the system
• How Compliance-Scope® models the complete EMC test environment — CE, RE, BCI, and RI — within a single platform without requiring additional tools
• How current density plots and E-field diagnostics helped real customers identify root causes and fix failures with minimal BOM changes
• How immunity failures at IC pins can be predicted in simulation before any hardware is tested in a lab

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