Study of Radiated Emission from an Automotive Touchscreen System – A Simulation Driven Approach
A. Devi, I. Musijchuk, D. Nath, S. Chasta and B. Nayak, "Study of Radiated Emission from an Automotive Touchscreen System – A Simulation Driven Approach," 2021 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), 2021, pp. 1-4, doi: 10.1109/APEMC49932.2021.9596724
CISPR 25 Radiated Emission Simulation and Measurement Correlation of an Automotive Reinforced Isolated Switch Driver
J. Chen, R. Murugan, S. Saw, F. Lauzurique, J. Broze, C. Greenberg, A. Triano, B. Nayak, H. Muniganti, J. Sivaswamy and D. Gope, "CISPR 25 Radiated Emission Simulation and Measurement Correlation of an Automotive Reinforced Isolated Switch Driver," 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), San Jose, CA, USA, 2022, pp. 1-3, doi: 10.1109/EPEPS53828.2022.9947145.
Multiscale EMC Modeling, Simulation, and Validation of a Synchronous Step-Down DCDC Converter
R. Murugan, J. Chen, A. Tripathi, B. P. Nayak, H. Muniganti, and D. Gope, “Multiscale EMC Modeling, Simulation, and Validation of a Synchronous Step-Down DCDC Converter“, Journal on Multiscale and Multiphysics Computation Techniques, vol. 8, pp. 269-280, 2023 doi: 10.1109/JMMCT.2023.3276358.
CISPR 25 Conducted Emission Simulation and Measurement Correlation of an Automotive Isolated Solid-State Relay
J. Chen, R. Murugan, J. Broze, P. Kittur, B. Marshall, T. Chen, A. Triano, B. Nayak, H. Muniganti, J. Sivaswamy and D. Gope, et al., "CISPR 25 Conducted Emission Simulation and Measurement Correlation of an Automotive Isolated Solid-State Relay," 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Milpitas, CA, USA, 2023, pp. 1-3, doi: 10.1109/EPEPS58208.2023.10314874.
Evaluation of Simulation-based Digital Front-Loading for Conducted Emission Challenges
A. Prasad, J. Pandya, A. Gavai, V. Sirajudheen, A. Adhyapak, M. Bisht, A. Davis, M. Sahoo, "Evaluation of Simulation-based Digital Front-Loading for Conducted Emission Challenges," 2023 Joint Asia-Pacific International Symposium on Electromagnetic Compatibility and International Conference on ElectroMagnetic Interference & Compatibility (APEMC/INCEMIC), Bengaluru, India, 2023, pp. 1-3, doi: 10.1109/APEMC57782.2023.10217362.
Simulation-Based Approach for Boost Converter using Black-Box Modelling for System Level EMC Analysis
Adish, S. R. Rao, A. Devi, J. Sivaswamy, D. Gope and P. Shanthi, "Simulation-Based Approach for Boost Converter using Black-Box Modelling for System Level EMC Analysis," 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), Grand Rapids, MI, USA, 2023, pp. 529-534, doi: 10.1109/EMCSIPI50001.2023.10241706.
Bulk Current Injection (BCI) Simulation and Measurement Correlation of an Automotive Battery Cell Voltages and Temperature Monitor IC
J. Chen, R. Murugan, V. Ravinuthula, W. Bristiel, T. Vogt, C. Huang, B. Nayak, J. Sivaswamy, H. Muniganti, D. Gope, "Bulk Current Injection (BCI) Simulation and Measurement Correlation of an Automotive Battery Cell Voltages and Temperature Monitor IC," 2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), Rose-Hill, Mauritius, 2023, pp. 1-3, doi: 10.1109/EDAPS58880.2023.10468198.
EMC Modeling of a Class-D Amplifier IC and Radiated Emission Correlation Studies for its Evaluation Board
Bisht, M. S., Devi, A., Davis A. K., Cacciagrano, P., Meroni, C., Girasole, E., and Cagnana, S., "EMC Modeling of a Class-D Amplifier IC and Radiated Emission Correlation Studies for its Evaluation Board," 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan/Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC), Okinawa, Japan, 2024, pp. 646-649, doi: 10.23919/EMCJapan/APEMCOkinaw58965.2024.10585017.
A Hybrid System-Level Modeling and Sensitivity Analysis Approach to Improve IC Immunity for Inductive Position Sensors in Noisy Automotive Environment
G. Shaga, M. Smith, B.S. Lingam, B. Nayak, N. Ambasana, “A Hybrid System-Level Modeling and Sensitivity Analysis Approach to Improve IC Immunity for Inductive Position Sensors in Noisy Automotive Environment”, 2026 DesignCon, Feb 24-26, 2026.
Practical Simulation Methods Considering Characteristic Variations of Wires for CISPR 25 Conducted Emission
H. Sugo, Y. Sarai, B. P. Nayak, H. Muniganti, D. Gope and T. Tsuda, “Practical Simulation Methods Considering Characteristic Variations of Wires for CISPR 25 Conducted Emission,” 2021 IEEE CPMT Symposium Japan (ICSJ), 2021, pp. 78-81, doi: 10.1109/ICSJ52620.2021.9648871.
Black-Box DC-DC Integrated Circuit Modeling towards Design for EMC in Automotive Electronics
N. Ishibashi, L. K. Manepalli, D. Nath, B. P. Nayak, S. Kadam and D. Gope, “Black-Box DC-DC Integrated Circuit Modeling towards Design for EMC in Automotive Electronics,” 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 2021,pp. 810-814, doi: 10.1109/EMC/SI/PI/EMCEurope52599.2021.9559210.
Study of Radiated Emission from an Automotive Touchscreen System – A Simulation Driven Approach
Anant Devi, Ihor Musijchuk, Debashish. Nath, Sourabh Chasta and Bibhu Nayak, “Study of Radiated Emission from an Automotive Touchscreen System – A Simulation Driven Approach,” 2021 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), 2021,pp. 1-4, doi: 10.1109/APEMC49932.2021.9596724.
Effect of Cable-bend on CISPR25 CE Current Method
B. P. Nayak, H. Muniganti, H. Sugo, Y. Sarai, T. Tsuda and D. Gope, “Effect of Cable-bend on CISPR25 CE Current Method,” 2021 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), 2021,, pp. 1-4, doi: 10.1109/APEMC49932.2021.9596715.
Use of Simulation in EMC optimization
Sheshadri, H., Nayak, B. and Kamath, A., 2018, November. Use of Simulation in EMC optimization. In 2018 15th International Conference on ElectroMagnetic Interference & Compatibility (INCEMIC) (pp. 1-4). IEEE.
Circuit models for Bulk Current Injection (BCI) clamps with multiple cables
Nayak, B.P., Das, A., Vedicherla, S.R. and Gope, D., 2018, May. Circuit models for bulk current injection (BCI) clamps with multiple cables. In 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) (pp. 1160-1163). IEEE.
Hardware-Simulation Correlation of BCI failures in Capacitive Touch Sensing Application using ICIM
Devi, A., Veluri, S.S., Nayak, B.P. and Prabhudesai, S., 2018, November. Hardware-Simulation Correlation of BCI failures in Capacitive Touch Sensing Application using ICIM. In 2018 15th International Conference on ElectroMagnetic Interference & Compatibility (INCEMIC) (pp. 1-4). IEEE.
Diagnosis of Radiating Elements for CISPR 25 RE Test Setup Using Huygens Box Method
Muniganti, H., Nayak, B. and Gope, D., 2020. Diagnosis of Radiating Elements for CISPR 25 RE Test Setup Using Huygens Box Method. IEEE Letters on Electromagnetic Compatibility Practice and Applications, 2(2), pp.40-45.
Model-Based System-Level EMI/EMC Simulation for BCI Pass-Fail Prediction
Nayak, B.P., Ramesh, S., Rajeev, S., Devi, A., Tsuda, T. and Gope, D., 2020. Model-Based System-Level EMI/EMC Simulation for BCI Pass-Fail Prediction. IEEE Letters on Electromagnetic Compatibility Practice and Applications, 2(2), pp.28-33.
